Documentos Técnicos
Especificações
Brand
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
País de Origem
United States
Detalhes do produto
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
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R$ 52,10
Each (In a Bag of 50) (Sem VAT)
50
R$ 52,10
Each (In a Bag of 50) (Sem VAT)
50
Comprar em grandes quantidades
Quantidade | Preço unitário | Per Saco |
---|---|---|
50 - 450 | R$ 52,10 | R$ 2.605,00 |
500 - 1200 | R$ 51,06 | R$ 2.553,00 |
1250 - 2450 | R$ 50,12 | R$ 2.506,00 |
2500 - 4950 | R$ 49,22 | R$ 2.461,00 |
5000+ | R$ 48,38 | R$ 2.419,00 |
Documentos Técnicos
Especificações
Brand
BergquistThickness
0.001in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
País de Origem
United States
Detalhes do produto
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.