Documentos Técnicos
Especificações
Brand
BergquistDimensions
11 x 12in
Thickness
0.001in
Length
11in
Width
12in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
País de Origem
United States
Detalhes do produto
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.
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R$ 2.278,20
Each (Sem VAT)
1
R$ 2.278,20
Each (Sem VAT)
1
Comprar em grandes quantidades
Quantidade | Preço unitário |
---|---|
1 - 9 | R$ 2.278,20 |
10 - 24 | R$ 2.134,86 |
25 - 49 | R$ 2.092,49 |
50 - 99 | R$ 2.054,12 |
100+ | R$ 2.018,10 |
Documentos Técnicos
Especificações
Brand
BergquistDimensions
11 x 12in
Thickness
0.001in
Length
11in
Width
12in
Thermal Conductivity
1.5W/m·K
Material
Hi-Flow 650P
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+150°C
Material Trade Name
Hi-Flow 650P
Operating Temperature Range
-40 → +150 °C
País de Origem
United States
Detalhes do produto
Hi-Flow 650P
Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules.