Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 41.91 x 28.96mm

Nº de Estoque RS: 169-2357Marca: BergquistPart Number: SP2000-0.015-00-05
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Documentos Técnicos

Especificações

Dimensions

41.91 x 28.96mm

Thickness

0.015in

Length

41.91mm

Width

28.96mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

País de Origem

United States

Detalhes do produto

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.

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R$ 111,36

Each (In a Pack of 10) (Sem VAT)

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 41.91 x 28.96mm

R$ 111,36

Each (In a Pack of 10) (Sem VAT)

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 41.91 x 28.96mm
Informações de estoque temporariamente indisponíveis.

Comprar em grandes quantidades

QuantidadePreço unitárioPer Pacote
10 - 40R$ 111,36R$ 1.113,60
50 - 240R$ 107,87R$ 1.078,70
250+R$ 104,69R$ 1.046,90

Documentos Técnicos

Especificações

Dimensions

41.91 x 28.96mm

Thickness

0.015in

Length

41.91mm

Width

28.96mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

País de Origem

United States

Detalhes do produto

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.