Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 11.1 x 7.92mm

Nº de Estoque RS: 169-2379Marca: BergquistPart Number: SP2000-0.015-00-50
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Documentos Técnicos

Especificações

Brand

Bergquist

Dimensions

11.1 x 7.92mm

Thickness

0.015in

Length

11.1mm

Width

7.92mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

País de Origem

United States

Detalhes do produto

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.

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P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 11.1 x 7.92mm

10

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P.O.A.

Bergquist Thermal Interface Pad, 0.015in Thick, 3.5W/m·K, Fibreglass, 11.1 x 7.92mm
Informações de estoque temporariamente indisponíveis.

10

Disponível em múltiplos de 10
10P.O.A.
20P.O.A.
30P.O.A.
40P.O.A.
50P.O.A.
60P.O.A.
70P.O.A.
80P.O.A.
90P.O.A.
100P.O.A.
110P.O.A.
120P.O.A.
130P.O.A.
140P.O.A.
150P.O.A.

Documentos Técnicos

Especificações

Brand

Bergquist

Dimensions

11.1 x 7.92mm

Thickness

0.015in

Length

11.1mm

Width

7.92mm

Thermal Conductivity

3.5W/m·K

Material

Fibreglass

Minimum Operating Temperature

-60°C

Maximum Operating Temperature

+200°C

Hardness

Shore A 90

Material Trade Name

Sil-Pad 2000

Operating Temperature Range

-60 → +200 °C

País de Origem

United States

Detalhes do produto

Bergquist Sil-Pad 2000

Bergquist Sil-Pad 2000 is a high performance, thermally conductive insulator designed for demanding military/aerospace and other commercial applications. Sil-Pad 2000 is a grease-free, conformable material capable of meetingor exceeding both the thermal and electrical requirements of high-reliability electronic packaging applications.