Documentos Técnicos
Especificações
Brand
SamtecNumber Of Contacts
60
Number Of Rows
2
Pitch
0.8mm
Type
Board to Board
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.4A
Voltage Rating
200 V
Series
ERF8
Contact Material
Beryllium Copper
Detalhes do produto
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.
0.8mm Board to Board - Samtec
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P.O.A.
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P.O.A.
Padrão
1
Documentos Técnicos
Especificações
Brand
SamtecNumber Of Contacts
60
Number Of Rows
2
Pitch
0.8mm
Type
Board to Board
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
1.4A
Voltage Rating
200 V
Series
ERF8
Contact Material
Beryllium Copper
Detalhes do produto
ERF8 Series Rugged High Speed Sockets
These Board to Board ERF8 Series, SMT, 0.8 mm pitch high speed Sockets from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERF8 Series, SMT, 0.8 mm pitch high speed Sockets have an above board height of 5.1 mm.