Documentos Técnicos
Especificações
Brand
KEMETCapacitance
220nF
Voltage
50V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±10%
Dimensions
2 x 1.25 x 1.25mm
Length
2mm
Depth
1.25mm
Height
1.25mm
Series
C
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Detalhes do produto
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
R$ 365,00
R$ 0,73 Each (On a Reel of 500) (Sem VAT)
Padrão
500
R$ 365,00
R$ 0,73 Each (On a Reel of 500) (Sem VAT)
Padrão
500
Informações de estoque temporariamente indisponíveis.
Verifique novamente mais tarde.
Quantidade | Preço unitário | Per Bobina |
---|---|---|
500 - 2000 | R$ 0,73 | R$ 365,00 |
2500+ | R$ 0,58 | R$ 290,00 |
Documentos Técnicos
Especificações
Brand
KEMETCapacitance
220nF
Voltage
50V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
X7R
Tolerance
±10%
Dimensions
2 x 1.25 x 1.25mm
Length
2mm
Depth
1.25mm
Height
1.25mm
Series
C
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Detalhes do produto
KEMET C0805 Series
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.