HARWIN 5.5mm Grounding Contact

Nº de Estoque RS: 788-4868Marca: HARWINPart Number: S7061-42R
brand-logo
Ver tudo em Ligação Terra

Documentos Técnicos

Especificações

Brand

HARWIN

Material

Titanium Copper Alloy

Series

EZ-BoardWare

Current Rating

4A

Fixing Method

Surface Mount

Contact Plating

Gold

Dimensions

7 x 2.5 x 5.5mm

Height

5.5mm

Length

7mm

Width

2.5mm

País de Origem

China

Detalhes do produto

Harwin EZ Boardware SMT RFI/Grounding Spring Contacts

EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.

Informações de estoque temporariamente indisponíveis.

Verifique novamente mais tarde.

Informações de estoque temporariamente indisponíveis.

R$ 71,60

R$ 7,16 Each (In a Pack of 10) (Sem VAT)

HARWIN 5.5mm Grounding Contact
Selecione o tipo de embalagem

R$ 71,60

R$ 7,16 Each (In a Pack of 10) (Sem VAT)

HARWIN 5.5mm Grounding Contact
Informações de estoque temporariamente indisponíveis.
Selecione o tipo de embalagem

Comprar em grandes quantidades

QuantidadePreço unitárioPer Pacote
10 - 190R$ 7,16R$ 71,60
200 - 740R$ 6,14R$ 61,40
750 - 2990R$ 5,94R$ 59,40
3000 - 5990R$ 4,86R$ 48,60
6000+R$ 4,69R$ 46,90

Documentos Técnicos

Especificações

Brand

HARWIN

Material

Titanium Copper Alloy

Series

EZ-BoardWare

Current Rating

4A

Fixing Method

Surface Mount

Contact Plating

Gold

Dimensions

7 x 2.5 x 5.5mm

Height

5.5mm

Length

7mm

Width

2.5mm

País de Origem

China

Detalhes do produto

Harwin EZ Boardware SMT RFI/Grounding Spring Contacts

EZ-BoardWare SMT grounding/RFI spring contacts for use on surface mount PCBs that are in contact with metal shields or frames. The simple C style design of these EZ-BoardWare spring contacts provides excellent spring properties and ensures positive contact with the mating surface. These EZ-BoardWare RFI/grounding contacts are suitable for both wiping and sliding actions and are ideal for automated requirements using standard placement equipment. Stock numbers 788-4852 and 788-4858 are multi-directional spring contacts that have a unique spring feature that works in both the vertical and horizontal orientations. This feature makes them ideal for use in PCB edge connections to a chassis.