Memory Card socket 200 way DDR2 SODIMM

Nº de Estoque RS: 756-1000Marca: TE ConnectivityPart Number: 1981284-4
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Documentos Técnicos

Especificações

Brand

TE Connectivity

Gender

Female

Body Orientation

Right Angle

Contact Material

Copper Alloy

Contact Plating

Gold

Number Of Contacts

200

Pitch

0.6mm

Mounting Type

PCB Mount

Termination Method

Solder

Housing Material

Thermoplastic

País de Origem

China

Detalhes do produto

TE Connectivity SO DIMM Socket for AdvancedMC Applications

200 way, dual row standard profile SO DIMM socket designed to meet AdvancedMC specifications and to fit any AdvancedMC application. This SMT PCB mounting SO DIMM socket has a 0.60mm centreline, ejector locking at both ends, a black high temperature thermoplastic housing and gold flash solder tail contact plating.

Informações de estoque temporariamente indisponíveis.

P.O.A.

Memory Card socket 200 way DDR2 SODIMM

1

Disponível em múltiplos de 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
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7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

P.O.A.

Memory Card socket 200 way DDR2 SODIMM
Informações de estoque temporariamente indisponíveis.

1

Disponível em múltiplos de 1
1P.O.A.
2P.O.A.
3P.O.A.
4P.O.A.
5P.O.A.
6P.O.A.
7P.O.A.
8P.O.A.
9P.O.A.
10P.O.A.
11P.O.A.
12P.O.A.
13P.O.A.
14P.O.A.
15P.O.A.

Informações de estoque temporariamente indisponíveis.

Verifique novamente mais tarde.

Documentos Técnicos

Especificações

Brand

TE Connectivity

Gender

Female

Body Orientation

Right Angle

Contact Material

Copper Alloy

Contact Plating

Gold

Number Of Contacts

200

Pitch

0.6mm

Mounting Type

PCB Mount

Termination Method

Solder

Housing Material

Thermoplastic

País de Origem

China

Detalhes do produto

TE Connectivity SO DIMM Socket for AdvancedMC Applications

200 way, dual row standard profile SO DIMM socket designed to meet AdvancedMC specifications and to fit any AdvancedMC application. This SMT PCB mounting SO DIMM socket has a 0.60mm centreline, ejector locking at both ends, a black high temperature thermoplastic housing and gold flash solder tail contact plating.