Fischer Elektronik Heatsink, Universal Square Alu, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil

Nº de Estoque RS: 674-4753Marca: Fischer ElektronikPart Number: ICK BGA 27x27x22
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Documentos Técnicos

Especificações

For Use With

Universal Square Alu

Length

27mm

Width

27mm

Height

22mm

Dimensions

27 x 27 x 22mm

Thermal Resistance

13.5K/W

Mounting

Adhesive Foil, Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

País de Origem

Germany

Detalhes do produto

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks

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Informações de estoque temporariamente indisponíveis.

R$ 251,34

R$ 251,34 Each (Sem VAT)

Fischer Elektronik Heatsink, Universal Square Alu, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil

R$ 251,34

R$ 251,34 Each (Sem VAT)

Fischer Elektronik Heatsink, Universal Square Alu, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil
Informações de estoque temporariamente indisponíveis.

Informações de estoque temporariamente indisponíveis.

Verifique novamente mais tarde.

QuantidadePreço unitário
1 - 9R$ 251,34
10 - 24R$ 234,91
25 - 49R$ 227,66
50 - 99R$ 223,30
100+R$ 208,12

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Documentos Técnicos

Especificações

For Use With

Universal Square Alu

Length

27mm

Width

27mm

Height

22mm

Dimensions

27 x 27 x 22mm

Thermal Resistance

13.5K/W

Mounting

Adhesive Foil, Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

País de Origem

Germany

Detalhes do produto

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more