Documentos Técnicos
Especificações
Brand
KEMETCapacitance
100nF
Voltage
275V ac
Mounting Type
Through Hole
Tolerance
±20%
Series
P409
Lead Pitch
20.3mm
Suppression Class
X2
Length
24mm
Depth
7.6mm
Height
14mm
Dimensions
24 x 7.6 x 14mm
Lead Diameter
0.8mm
Maximum Operating Temperature
+85°C
Minimum Operating Temperature
-40°C
Detalhes do produto
P409 X2 Series Metallised Paper
The P409 Series is constructed of multilayer metallized paper encapsulated and impregnated in self-extinguishing material meeting the requirements of UL 94 V–0.
Impregnated paper ensures excellent stability and reliability properties, particularly in applications with continuous operation.
Applications include worldwide use in contact protection, contact interference suppression and transient suppression.
Approvals
ENEC, UL and cUL
Informações de estoque temporariamente indisponíveis.
Verifique novamente mais tarde.
R$ 48,24
Each (In a Pack of 5) (Sem VAT)
5
R$ 48,24
Each (In a Pack of 5) (Sem VAT)
5
Comprar em grandes quantidades
Quantidade | Preço unitário | Per Pacote |
---|---|---|
5 - 20 | R$ 48,24 | R$ 241,20 |
25 - 45 | R$ 39,17 | R$ 195,85 |
50 - 120 | R$ 34,34 | R$ 171,70 |
125 - 245 | R$ 29,99 | R$ 149,95 |
250+ | R$ 27,05 | R$ 135,25 |
Documentos Técnicos
Especificações
Brand
KEMETCapacitance
100nF
Voltage
275V ac
Mounting Type
Through Hole
Tolerance
±20%
Series
P409
Lead Pitch
20.3mm
Suppression Class
X2
Length
24mm
Depth
7.6mm
Height
14mm
Dimensions
24 x 7.6 x 14mm
Lead Diameter
0.8mm
Maximum Operating Temperature
+85°C
Minimum Operating Temperature
-40°C
Detalhes do produto
P409 X2 Series Metallised Paper
The P409 Series is constructed of multilayer metallized paper encapsulated and impregnated in self-extinguishing material meeting the requirements of UL 94 V–0.
Impregnated paper ensures excellent stability and reliability properties, particularly in applications with continuous operation.
Applications include worldwide use in contact protection, contact interference suppression and transient suppression.
Approvals
ENEC, UL and cUL