Documentos Técnicos
Especificações
Brand
MG ChemicalsProduct Material
Epoxy
Package Type
Can
Package Size
2.55 L
Cure Time
35 min → 24 h
Colour
Black
Maximum Operating Temperature
+145°C
Minimum Operating Temperature
-30°C
Operating Temperature Range
-30 → +145 °C
Viscosity Measurement
3300cP/s
Physical Form
Liquid
Chemical Composition
Acetone, Ethyl Lactate, Hydrocloric Acid, Isohexanes, Isopropyl Alcohol, Mineral Spirits, Water, Xylene
Setting Time
60min
País de Origem
Canada
Detalhes do produto
MG Chemicals Epoxy Potting Compounds
The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.
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R$ 4.203,96
Each (Sem VAT)
1
R$ 4.203,96
Each (Sem VAT)
1
Comprar em grandes quantidades
Quantidade | Preço unitário |
---|---|
1 - 5 | R$ 4.203,96 |
6 - 14 | R$ 4.098,20 |
15+ | R$ 4.073,34 |
Documentos Técnicos
Especificações
Brand
MG ChemicalsProduct Material
Epoxy
Package Type
Can
Package Size
2.55 L
Cure Time
35 min → 24 h
Colour
Black
Maximum Operating Temperature
+145°C
Minimum Operating Temperature
-30°C
Operating Temperature Range
-30 → +145 °C
Viscosity Measurement
3300cP/s
Physical Form
Liquid
Chemical Composition
Acetone, Ethyl Lactate, Hydrocloric Acid, Isohexanes, Isopropyl Alcohol, Mineral Spirits, Water, Xylene
Setting Time
60min
País de Origem
Canada
Detalhes do produto
MG Chemicals Epoxy Potting Compounds
The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.