Documentos Técnicos
Especificações
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
22
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-42-683
Detalhes do produto
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs
Molex Micro-Fit 3.0 Series
Informações de estoque temporariamente indisponíveis.
R$ 634,40
R$ 126,88 Each (In a Pack of 5) (Sem VAT)
Padrão
5
R$ 634,40
R$ 126,88 Each (In a Pack of 5) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Padrão
5
| Quantidade | Preço unitário | Per Pacote |
|---|---|---|
| 5 - 95 | R$ 126,88 | R$ 634,40 |
| 100 - 370 | R$ 91,10 | R$ 455,50 |
| 375 - 1495 | R$ 88,80 | R$ 444,00 |
| 1500 - 2995 | R$ 77,36 | R$ 386,80 |
| 3000+ | R$ 75,38 | R$ 376,90 |
Documentos Técnicos
Especificações
Brand
MolexSeries
Micro-Fit 3.0
Product Type
PCB Header
Pitch
3mm
Current
5A
Number of Contacts
22
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-42-683
Detalhes do produto
Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Snap in Plastic Peg PCB Lock, 43045 Series
Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs


