Documentos Técnicos
Especificações
Brand
MolexSeries
MICRO-LATCH
Pitch
2.0mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Material
Brass
Contact Plating
Tin
Current Rating
2.0A
Series Number
53253
Voltage Rating
125.0 V
Detalhes do produto
Headers, 53253 Series
2.0mm Wire to Board Molex Micro-Latch
This system applies a friction lock mechanism where the noses on receptacle housings slide into the header wall openings. This ensures a durable mating and a protection of the electrical circuitry.
P.O.A.
Each (Supplied in a Box) (Sem VAT)
Embalagem de Produção (Caixa)
5
P.O.A.
Each (Supplied in a Box) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Embalagem de Produção (Caixa)
5
Informações de estoque temporariamente indisponíveis.
Documentos Técnicos
Especificações
Brand
MolexSeries
MICRO-LATCH
Pitch
2.0mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Material
Brass
Contact Plating
Tin
Current Rating
2.0A
Series Number
53253
Voltage Rating
125.0 V
Detalhes do produto
Headers, 53253 Series
2.0mm Wire to Board Molex Micro-Latch
This system applies a friction lock mechanism where the noses on receptacle housings slide into the header wall openings. This ensures a durable mating and a protection of the electrical circuitry.


