Documentos Técnicos
Especificações
Brand
MolexSeries
C-GRID III
Pitch
2.54mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Unshrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Gold
Contact Material
Brass
Series Number
90122
Current Rating
3.0A
Voltage Rating
350.0 V
Detalhes do produto
Molex C-Grid III 2.54 mm PCB Pin Headers - 90120, 90121, 90122 and 90131 Series
90120, 90121, 90122 and 90131 series PCB headers that form part of the 2.54 mm C-Grid III interconnection system designed to meet the latest industry requirements. These C-Grid III PCB headers mate with C-Grid III series PCB sockets and crimp housings for use in both board to board and wire to board applications. The headers have a breakaway design and can be cut to size for additional design flexibility. The pins of these PCB pin headers have a high retention force for a secure mating connection. The contacts, once soldered to the PCB also have a high mechanical stability. These 2.54 mm C-Grid PCB pin headers are available in single and dual row, vertical and right angle mounting configurations to suit a range of interconnection requirements.
2.54mm Molex C-Grid III Range
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Verifique novamente mais tarde.
R$ 33,43
Each (In a Tray of 400) (Sem VAT)
400
R$ 33,43
Each (In a Tray of 400) (Sem VAT)
400
Comprar em grandes quantidades
Quantidade | Preço unitário | Per Bandeja |
---|---|---|
400 - 400 | R$ 33,43 | R$ 13.372,00 |
800+ | R$ 31,45 | R$ 12.580,00 |
Documentos Técnicos
Especificações
Brand
MolexSeries
C-GRID III
Pitch
2.54mm
Number Of Contacts
8
Number Of Rows
2
Body Orientation
Right Angle
Shrouded/Unshrouded
Unshrouded
Connector System
Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Gold
Contact Material
Brass
Series Number
90122
Current Rating
3.0A
Voltage Rating
350.0 V
Detalhes do produto
Molex C-Grid III 2.54 mm PCB Pin Headers - 90120, 90121, 90122 and 90131 Series
90120, 90121, 90122 and 90131 series PCB headers that form part of the 2.54 mm C-Grid III interconnection system designed to meet the latest industry requirements. These C-Grid III PCB headers mate with C-Grid III series PCB sockets and crimp housings for use in both board to board and wire to board applications. The headers have a breakaway design and can be cut to size for additional design flexibility. The pins of these PCB pin headers have a high retention force for a secure mating connection. The contacts, once soldered to the PCB also have a high mechanical stability. These 2.54 mm C-Grid PCB pin headers are available in single and dual row, vertical and right angle mounting configurations to suit a range of interconnection requirements.