Documentos Técnicos
Especificações
Brand
MurataCapacitance
22µF
Voltage
4V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
X7U
Tolerance
±20%
Dimensions
2 x 1.25 x 1.25mm
Length
2mm
Depth
1.25mm
Height
1.25mm
Series
GRM
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Detalhes do produto
Murata GRM 0805 X5R, X7R and Y5V Dielectric
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
R$ 34,00
R$ 0,68 Each (In a Pack of 50) (Sem VAT)
Padrão
50
R$ 34,00
R$ 0,68 Each (In a Pack of 50) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Padrão
50
Informações de estoque temporariamente indisponíveis.
Documentos Técnicos
Especificações
Brand
MurataCapacitance
22µF
Voltage
4V dc
Package/Case
0805 (2012M)
Mounting Type
Surface Mount
Dielectric
X7U
Tolerance
±20%
Dimensions
2 x 1.25 x 1.25mm
Length
2mm
Depth
1.25mm
Height
1.25mm
Series
GRM
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Detalhes do produto
Murata GRM 0805 X5R, X7R and Y5V Dielectric
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
