Documentos Técnicos
Especificações
Brand
MurataInductance
33 nH
Maximum dc Current
200mA
Package/Case
0402
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
670mΩ
Series
LQG15HN
Core Material
Non-Magnetic Ceramic
Maximum Self Resonant Frequency
1500MHz
Minimum Quality Factor
8
Minimum Operating Temperature
-55°C
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
País de Origem
Japan
Detalhes do produto
Murata 0402 LQG15HN Series High Frequency Chip Inductors
LQG15HN SMD inductors from Murata feature a multilayer construction. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.
R$ 1.200,00
R$ 0,12 Each (On a Reel of 10000) (Sem VAT)
10000
R$ 1.200,00
R$ 0,12 Each (On a Reel of 10000) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
10000
Informações de estoque temporariamente indisponíveis.
Documentos Técnicos
Especificações
Brand
MurataInductance
33 nH
Maximum dc Current
200mA
Package/Case
0402
Length
1mm
Depth
0.5mm
Height
0.5mm
Dimensions
1 x 0.5 x 0.5mm
Tolerance
±5%
Maximum DC Resistance
670mΩ
Series
LQG15HN
Core Material
Non-Magnetic Ceramic
Maximum Self Resonant Frequency
1500MHz
Minimum Quality Factor
8
Minimum Operating Temperature
-55°C
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Moulded
Yes
País de Origem
Japan
Detalhes do produto
Murata 0402 LQG15HN Series High Frequency Chip Inductors
LQG15HN SMD inductors from Murata feature a multilayer construction. Despite a lower Q factor than wire wound equivalents, the multilayer construction provides excellent balance between rated current, size and L value tolerance among others.
LQGH15HS SMD inductors are highly reliable and suitable for application in chokes, WLAN networks, RF circuit matching and mobile communication equipment resonance.


