Documentos Técnicos
Especificações
Brand
ON SemiconductorMounting Type
Surface Mount
Package Type
SOIC
Power Supply Type
Dual
Number of Channels per Chip
2
Pin Count
8
Typical Gain Bandwidth Product
16MHz
Typical Dual Supply Voltage
±12 V, ±15 V, ±9 V
Typical Slew Rate
7V/µs
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
Typical Voltage Gain
110 dB
Rail to Rail
No
Height
1.5mm
Width
4mm
Dimensions
5 x 4 x 1.5mm
Typical Input Voltage Noise Density
4.5nV/√Hz
Length
5mm
País de Origem
Czech Republic
Detalhes do produto
MC33078, MC33079, Low Noise Dual/Quad Operational Amplifiers, ON Semiconductor
The MC33078/9 series is a family of monolithic op-amps employing Bipolar technology with for audio and data signal processing applications.
They use high frequency PNP input transistors to produce amplifiers with low input voltage noise, high gain bandwidth product and slew rate.
The MC33078/9 family is available in both dual and quad versions in either plastic DIP or SOIC packages (P and D suffixes).
Operational Amplifiers, ON Semiconductor
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Documentos Técnicos
Especificações
Brand
ON SemiconductorMounting Type
Surface Mount
Package Type
SOIC
Power Supply Type
Dual
Number of Channels per Chip
2
Pin Count
8
Typical Gain Bandwidth Product
16MHz
Typical Dual Supply Voltage
±12 V, ±15 V, ±9 V
Typical Slew Rate
7V/µs
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
Typical Voltage Gain
110 dB
Rail to Rail
No
Height
1.5mm
Width
4mm
Dimensions
5 x 4 x 1.5mm
Typical Input Voltage Noise Density
4.5nV/√Hz
Length
5mm
País de Origem
Czech Republic
Detalhes do produto
MC33078, MC33079, Low Noise Dual/Quad Operational Amplifiers, ON Semiconductor
The MC33078/9 series is a family of monolithic op-amps employing Bipolar technology with for audio and data signal processing applications.
They use high frequency PNP input transistors to produce amplifiers with low input voltage noise, high gain bandwidth product and slew rate.
The MC33078/9 family is available in both dual and quad versions in either plastic DIP or SOIC packages (P and D suffixes).