RS PRO GCS Series Thermal Interface Sheet, 2 mm Thick, 4 W/mK, 150 mm, 150mm, Silicone

Documentos Técnicos
Especificações
Brand
RS ProProduct Type
Thermal Interface Sheet
Thickness
2mm
Thermal Conductivity
4W/mK
Trade Name
Thermal Gap Pad
Hardness
Shore OO 40
Conductive Material
Silicone
Length
150mm
Standards/Approvals
REACH, RoHS
Width
150mm
Colour
Blue
Maximum Operating Temperature
200°C
Minimum Operating Temperature
-55°C
Series
GCS
País de Origem
Taiwan, Province Of China
Detalhes do produto
RS PRO Thermal Interface Silicone Gel Pads
RS PRO range of gel type silicone thermal pads which offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making installation simple and suitable for a wide scope of applications.
Options available:
Silicone gel pad, glass 150x150 mm (glass filled for added performance)
915-6039 - 0.5 mm
915-6032 - 1.0 mm
915-6036 - 1.5 mm
915-6045 - 2.0 mm
Silicone gel pad, 4W/mK, 150x150 mm
915-6048 - 0.5 mm
915-6042 - 1.0 mm
915-6051 - 1.5 mm
915-6054 - 2.0 mm
Silicone gel pad, 6W/mK, 150x150 mm
915-6058 - 0.5 mm
915-6067 - 1.0 mm
915-6060 - 1.5 mm
915-6064 - 2.0 mm
Silicone gel pad, 8W/mK, 150x150 mm
915-6073 - 0.5 mm
915-6076 - 1.0 mm
915-6070 - 1.5 mm
915-6089 - 2.0 mm
Thermal gap pads provide a thermal interface between heatsinks (devices or substances for absorbing unwanted or excess heat) and electronic devices. Theyre particularly useful where air gaps, rough surface textures or uneven surface topography prevent the use of traditional grease or paste.
Thermal gap pads are solid at room temperature, but as heat rises, they grow softer and can fill gaps. Often, devices are not entirely flush with the heatsink, and when the pad grows soft, it can spread and fill that gap.
RS PRO have a great range of products for the heating or cooling of electronic devices, components or enclosures to help devices maintain the right temperature to work effectively.
Informações de estoque temporariamente indisponíveis.
R$ 1.299,64
R$ 1.299,64 Each (Sem VAT)
1
R$ 1.299,64
R$ 1.299,64 Each (Sem VAT)
Informações de estoque temporariamente indisponíveis.
1
| Quantidade | Preço unitário |
|---|---|
| 1 - 9 | R$ 1.299,64 |
| 10 - 24 | R$ 1.214,06 |
| 25 - 49 | R$ 1.178,77 |
| 50+ | R$ 1.155,73 |
Documentos Técnicos
Especificações
Brand
RS ProProduct Type
Thermal Interface Sheet
Thickness
2mm
Thermal Conductivity
4W/mK
Trade Name
Thermal Gap Pad
Hardness
Shore OO 40
Conductive Material
Silicone
Length
150mm
Standards/Approvals
REACH, RoHS
Width
150mm
Colour
Blue
Maximum Operating Temperature
200°C
Minimum Operating Temperature
-55°C
Series
GCS
País de Origem
Taiwan, Province Of China
Detalhes do produto
RS PRO Thermal Interface Silicone Gel Pads
RS PRO range of gel type silicone thermal pads which offer high performance and come in a multitude of thermal conductivity ratings and thicknesses. They are ultra-soft and have a natural tack making installation simple and suitable for a wide scope of applications.
Options available:
Silicone gel pad, glass 150x150 mm (glass filled for added performance)
915-6039 - 0.5 mm
915-6032 - 1.0 mm
915-6036 - 1.5 mm
915-6045 - 2.0 mm
Silicone gel pad, 4W/mK, 150x150 mm
915-6048 - 0.5 mm
915-6042 - 1.0 mm
915-6051 - 1.5 mm
915-6054 - 2.0 mm
Silicone gel pad, 6W/mK, 150x150 mm
915-6058 - 0.5 mm
915-6067 - 1.0 mm
915-6060 - 1.5 mm
915-6064 - 2.0 mm
Silicone gel pad, 8W/mK, 150x150 mm
915-6073 - 0.5 mm
915-6076 - 1.0 mm
915-6070 - 1.5 mm
915-6089 - 2.0 mm
Thermal gap pads provide a thermal interface between heatsinks (devices or substances for absorbing unwanted or excess heat) and electronic devices. Theyre particularly useful where air gaps, rough surface textures or uneven surface topography prevent the use of traditional grease or paste.
Thermal gap pads are solid at room temperature, but as heat rises, they grow softer and can fill gaps. Often, devices are not entirely flush with the heatsink, and when the pad grows soft, it can spread and fill that gap.
RS PRO have a great range of products for the heating or cooling of electronic devices, components or enclosures to help devices maintain the right temperature to work effectively.