Documentos Técnicos
Especificações
Brand
SamtecSeries
ERM8
Pitch
0.8mm
Number Of Contacts
100
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Current Rating
1.4A
Voltage Rating
200.0 V
Detalhes do produto
ERM8 Series Rugged High Speed Headers Style 2
These Board to Board ERM8 Series, SMT, 0.8 mm pitch high speed Headers from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERM8 Series, SMT, 0.8 mm pitch high speed Style 2 Headers have an overall board height of 5.97 mm with a wafer height of 1.61 mm.
0.8mm Board to Board - Samtec
P.O.A.
Embalagem de Produção (Bobina)
1
P.O.A.
Informações de estoque temporariamente indisponíveis.
Embalagem de Produção (Bobina)
1
Informações de estoque temporariamente indisponíveis.
Documentos Técnicos
Especificações
Brand
SamtecSeries
ERM8
Pitch
0.8mm
Number Of Contacts
100
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Current Rating
1.4A
Voltage Rating
200.0 V
Detalhes do produto
ERM8 Series Rugged High Speed Headers Style 2
These Board to Board ERM8 Series, SMT, 0.8 mm pitch high speed Headers from Samtec have 0.76 μm Gold plating on the robust Edge Rate contacts and Tin on the PCB tails. This Board-to-Board range of ERM8 Series, SMT, 0.8 mm pitch high speed Style 2 Headers have an overall board height of 5.97 mm with a wafer height of 1.61 mm.


