Documentos Técnicos
Especificações
Brand
SamtecSeries
QTE
Product Type
PCB Header
Pitch
0.8mm
Current
1.3A
Number of Contacts
40
Housing Material
Liquid Crystal Polymer
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Voltage
225 V
Detalhes do produto
QTE Series High Speed Ground Plane Headers
This range of Board to Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have Alignment Pins. The Contacts and metal ground planes of these Board-to-Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have 0.25 μm Gold plating with the tails being Tin plated.
0.8mm Board to Board - Samtec
Informações de estoque temporariamente indisponíveis.
P.O.A.
Padrão
1
P.O.A.
Informações de estoque temporariamente indisponíveis.
Padrão
1
Documentos Técnicos
Especificações
Brand
SamtecSeries
QTE
Product Type
PCB Header
Pitch
0.8mm
Current
1.3A
Number of Contacts
40
Housing Material
Liquid Crystal Polymer
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board-to-Board
Mount Type
Surface
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Voltage
225 V
Detalhes do produto
QTE Series High Speed Ground Plane Headers
This range of Board to Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have Alignment Pins. The Contacts and metal ground planes of these Board-to-Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have 0.25 μm Gold plating with the tails being Tin plated.


