Samtec SEAF Series Straight Surface Mount PCB Socket, 160-Contact, 8-Row, 1.27mm Pitch, Solder Termination
Documentos Técnicos
Especificações
Brand
SamtecNumber Of Contacts
160
Number Of Rows
8
Pitch
1.27mm
Type
Board to Board
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
2.3A
Voltage Rating
240 V
Series
SEAF
Contact Material
Copper
Detalhes do produto
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
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Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Documentos Técnicos
Especificações
Brand
SamtecNumber Of Contacts
160
Number Of Rows
8
Pitch
1.27mm
Type
Board to Board
Mounting Type
Surface Mount
Body Orientation
Straight
Termination Method
Solder
Current Rating
2.3A
Voltage Rating
240 V
Series
SEAF
Contact Material
Copper
Detalhes do produto
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products