Documentos Técnicos
Especificações
Brand
TDKPackage Type
0805
Product Type
High Current Chip Power Line Bead
Packaging
Taping
Impedance at 100 MHz
330Ω
Current Rating
2.5A
Sub Type
Chip Bead
Mount Type
Surface
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Maximum DC Resistance
0.050Ω
Length
2mm
Height
0.85mm
Depth
1.25mm
Standards/Approvals
RoHS Directive
Automotive Standard
No
Application
Smart Grids, Various Modules, Household Appliances Such As Stbs, Industrial Equipment, Noise Removal
Series
MPZ
Material
Material: Ferrite Core
Detalhes do produto
Chip bead 0805 MPZ series
Informações de estoque temporariamente indisponíveis.
P.O.A.
Each (Supplied on a Reel) (Sem VAT)
Embalagem de Produção (Bobina)
100
P.O.A.
Each (Supplied on a Reel) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Embalagem de Produção (Bobina)
100
Documentos Técnicos
Especificações
Brand
TDKPackage Type
0805
Product Type
High Current Chip Power Line Bead
Packaging
Taping
Impedance at 100 MHz
330Ω
Current Rating
2.5A
Sub Type
Chip Bead
Mount Type
Surface
Minimum Operating Temperature
-55°C
Maximum Operating Temperature
125°C
Maximum DC Resistance
0.050Ω
Length
2mm
Height
0.85mm
Depth
1.25mm
Standards/Approvals
RoHS Directive
Automotive Standard
No
Application
Smart Grids, Various Modules, Household Appliances Such As Stbs, Industrial Equipment, Noise Removal
Series
MPZ
Material
Material: Ferrite Core
Detalhes do produto


