TE Connectivity Vibration Sensor, 0°C → +70°C

Nº de Estoque RS: 893-7231PMarca: TE ConnectivityPart Number: 1-1000288-0
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Documentos Técnicos

Especificações

Length

41mm

Width

16mm

Depth

0.075mm

Minimum Operating Temperature

0°C

Maximum Operating Temperature

+70°C

Dimensions

41 (mm) x 16 (mm) x 75 (μm)

Detalhes do produto

TE Connectivity SDT Series Shielded Piezo Vibration Sensors

TE Connectivity’s MEAS SDT series are piezoelectric sensors constructed with a folded film element printed with silver ink attached to moulded plastic housing with an 18” coaxial cable. The folded element self-shields the transducer area, which for high EMI environments is particularly important. Using glue or epoxy, these piezoresistive vibration sensors can be adhered directly to surfaces.

Suitable applications include vibration/impact sensing, acoustic pickup, vibration analysis for equipment and product design, contact microphones, machine monitoring, acoustic emission detection and machine tool chatter detection.

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P.O.A.

TE Connectivity Vibration Sensor, 0°C → +70°C
Selecione o tipo de embalagem

P.O.A.

TE Connectivity Vibration Sensor, 0°C → +70°C
Informações de estoque temporariamente indisponíveis.
Selecione o tipo de embalagem

Documentos Técnicos

Especificações

Length

41mm

Width

16mm

Depth

0.075mm

Minimum Operating Temperature

0°C

Maximum Operating Temperature

+70°C

Dimensions

41 (mm) x 16 (mm) x 75 (μm)

Detalhes do produto

TE Connectivity SDT Series Shielded Piezo Vibration Sensors

TE Connectivity’s MEAS SDT series are piezoelectric sensors constructed with a folded film element printed with silver ink attached to moulded plastic housing with an 18” coaxial cable. The folded element self-shields the transducer area, which for high EMI environments is particularly important. Using glue or epoxy, these piezoresistive vibration sensors can be adhered directly to surfaces.

Suitable applications include vibration/impact sensing, acoustic pickup, vibration analysis for equipment and product design, contact microphones, machine monitoring, acoustic emission detection and machine tool chatter detection.