TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Nº de Estoque RS: 718-1544Marca: TE ConnectivityPart Number: 120954-1
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Documentos Técnicos

Especificações

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

País de Origem

United States

Detalhes do produto

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

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R$ 194,86

R$ 194,86 Each (Sem VAT)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way
Selecione o tipo de embalagem

R$ 194,86

R$ 194,86 Each (Sem VAT)

TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way

Informações de estoque temporariamente indisponíveis.

Selecione o tipo de embalagem

Informações de estoque temporariamente indisponíveis.

QuantidadePreço unitário
1 - 19R$ 194,86
20 - 74R$ 188,10
75 - 299R$ 181,28
300 - 599R$ 176,86
600+R$ 174,90

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Documentos Técnicos

Especificações

Number Of Contacts

4

Number Of Rows

1

Body Orientation

Right Angle

Pitch

2mm

Contact Material

Copper Alloy

Mounting Type

Through Hole

Contact Plating

Gold

Current Rating

16A

Termination Method

Press Fit

Series

Z-PACK

País de Origem

United States

Detalhes do produto

Z-PACK™ HS3 Connectors

The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more