Documentos Técnicos
Especificações
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Orientation
Right Angle
Number of Columns
4
Voltage
250 V
Number of Rows
1
Connector Gender
Male
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Informações de estoque temporariamente indisponíveis.
R$ 277,96
R$ 277,96 Each (Sem VAT)
Padrão
1
R$ 277,96
R$ 277,96 Each (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Padrão
1
| Quantidade | Preço unitário |
|---|---|
| 1 - 19 | R$ 277,96 |
| 20 - 74 | R$ 268,25 |
| 75 - 299 | R$ 258,61 |
| 300 - 599 | R$ 252,26 |
| 600+ | R$ 249,59 |
Documentos Técnicos
Especificações
Brand
TE ConnectivityBackplane Connector Type
Hard Metric Type A
Product Type
Backplane Connector
Number of Contacts
4
Current
16A
Orientation
Right Angle
Number of Columns
4
Voltage
250 V
Number of Rows
1
Connector Gender
Male
Housing Material
Glass Filled Polyester
Pitch
2mm
Contact Material
Copper Alloy
Mount Type
Through Hole
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Termination Type
Press Fit
Contact Gender
Male
Maximum Operating Temperature
125°C
Standards/Approvals
No
Series
Z-PACK HM
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


