Documentos Técnicos
Especificações
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Contact Plating
Gold
Current Rating
16A
Termination Method
Press Fit
Series
Z-PACK
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
R$ 194,86
R$ 194,86 Each (Sem VAT)
Padrão
1
R$ 194,86
R$ 194,86 Each (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Padrão
1
Informações de estoque temporariamente indisponíveis.
| Quantidade | Preço unitário |
|---|---|
| 1 - 19 | R$ 194,86 |
| 20 - 74 | R$ 188,10 |
| 75 - 299 | R$ 181,28 |
| 300 - 599 | R$ 176,86 |
| 600+ | R$ 174,90 |
Documentos Técnicos
Especificações
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Contact Plating
Gold
Current Rating
16A
Termination Method
Press Fit
Series
Z-PACK
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


