Documentos Técnicos
Especificações
Brand
TE ConnectivityProduct Type
Backplane Connector
Pole Format
4
Current
10A
Voltage
250 V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Plating
Gold over Palladium Nickel over Nickel
Contact Gender
Female
Maximum Operating Temperature
125°C
Standards/Approvals
No
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Informações de estoque temporariamente indisponíveis.
R$ 213,70
R$ 213,70 Each (Sem VAT)
Padrão
1
R$ 213,70
R$ 213,70 Each (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Padrão
1
Documentos Técnicos
Especificações
Brand
TE ConnectivityProduct Type
Backplane Connector
Pole Format
4
Current
10A
Voltage
250 V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Plating
Gold over Palladium Nickel over Nickel
Contact Gender
Female
Maximum Operating Temperature
125°C
Standards/Approvals
No
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.


