TE Connectivity Backplane Connector Through Hole, 4, 250V 10A
Documentos Técnicos
Especificações
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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Informações de estoque temporariamente indisponíveis.
P.O.A.
Embalagem de Produção (Tubo)
1
P.O.A.
Informações de estoque temporariamente indisponíveis.
Embalagem de Produção (Tubo)
1
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Documentos Técnicos
Especificações
Brand
TE ConnectivityPole Format
4
Product Type
Backplane Connector
Current
10A
Voltage
250V
Connector Gender
Female
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Housing Material
Polyethylene Terephthalate
Minimum Operating Temperature
-55°C
Contact Gender
Female
Maximum Operating Temperature
125°C
Contact Plating
Gold over Palladium Nickel over Nickel
Standards/Approvals
No
País de Origem
United States
Detalhes do produto
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products