Documentos Técnicos
Especificações
Brand
TokoInductance
3.6 nH
Maximum dc Current
250mA
Package/Case
0201 (0603M)
Length
0.6mm
Depth
0.3mm
Height
0.3mm
Dimensions
0.6 x 0.3 x 0.3mm
Tolerance
±0.2nH
Maximum DC Resistance
280mΩ
Series
LLS0603-FH
Core Material
Ceramic
Maximum Self Resonant Frequency
5GHz
Minimum Quality Factor
11
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
País de Origem
China
Detalhes do produto
Toko 0201 LLS0603-FH Series Multilayer Ceramic Inductors
TOKO LLS0603-FH series multilayer chip inductors are highly reliable multilayer SMD inductors with a dual frequency standard per inductance value, plated terminals, integrated ceramic structure and tight physical tolerance dimensions. The LLS0603-FH series inductors are ideal for use in RF modules, embedded subassemblies or other applications where space is limited and printed stripline inductors are impractical.
P.O.A.
Each (Supplied on a Reel) (Sem VAT)
Embalagem de Produção (Bobina)
100
P.O.A.
Each (Supplied on a Reel) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Embalagem de Produção (Bobina)
100
Informações de estoque temporariamente indisponíveis.
Documentos Técnicos
Especificações
Brand
TokoInductance
3.6 nH
Maximum dc Current
250mA
Package/Case
0201 (0603M)
Length
0.6mm
Depth
0.3mm
Height
0.3mm
Dimensions
0.6 x 0.3 x 0.3mm
Tolerance
±0.2nH
Maximum DC Resistance
280mΩ
Series
LLS0603-FH
Core Material
Ceramic
Maximum Self Resonant Frequency
5GHz
Minimum Quality Factor
11
Inductor Construction
Multilayer
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
País de Origem
China
Detalhes do produto
Toko 0201 LLS0603-FH Series Multilayer Ceramic Inductors
TOKO LLS0603-FH series multilayer chip inductors are highly reliable multilayer SMD inductors with a dual frequency standard per inductance value, plated terminals, integrated ceramic structure and tight physical tolerance dimensions. The LLS0603-FH series inductors are ideal for use in RF modules, embedded subassemblies or other applications where space is limited and printed stripline inductors are impractical.


