Documentos Técnicos
Especificações
Brand
WinbondMemory Size
64Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
8
Organisation
8M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W25Q
Number of Words
8M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
País de Origem
China
Informações de estoque temporariamente indisponíveis.
Verifique novamente mais tarde.
P.O.A.
Embalagem de Produção (Tubo)
10
P.O.A.
Embalagem de Produção (Tubo)
10
Documentos Técnicos
Especificações
Brand
WinbondMemory Size
64Mbit
Interface Type
Quad-SPI
Package Type
SOIC
Pin Count
8
Organisation
8M x 8 bit
Mounting Type
Surface Mount
Cell Type
NOR
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Block Organisation
Symmetrical
Length
5.38mm
Height
1.91mm
Width
5.38mm
Dimensions
5.38 x 5.38 x 1.91mm
Series
W25Q
Number of Words
8M
Minimum Operating Temperature
-40 °C
Number of Bits per Word
8bit
Maximum Operating Temperature
+85 °C
Maximum Random Access Time
6ns
País de Origem
China