Documentos Técnicos
Especificações
Brand
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
18
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Surface
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Solder
Maximum Operating Temperature
125°C
Standards/Approvals
CSA LR19980, UL E29179
País de Origem
China
Detalhes do produto
The Molex Micro-Fit 3.0 Vertical Header is engineered for reliable interconnections in Compact electronic assemblies. This robust header features a 3.00mm pitch, accommodating dual rows with 18 circuits, and is equipped with solder tabs for secure connections. Designed for power and wire-to-board applications, it provides excellent durability and thermal efficiency, ensuring optimal performance in high-temperature environments. The vertical orientation and Compact size facilitate easy integration into various PCB designs, making it an Ideal choice for engineers seeking efficiency and reliability in their electronic applications.
Informações de estoque temporariamente indisponíveis.
R$ 45.247,90
R$ 45.247,90 1 Reel of 200 (Sem VAT)
1
R$ 45.247,90
R$ 45.247,90 1 Reel of 200 (Sem VAT)
Informações de estoque temporariamente indisponíveis.
1
Documentos Técnicos
Especificações
Brand
MolexProduct Type
Header
Series
43045
Pitch
3mm
Current
8.5A
Number of Contacts
18
Housing Material
High Temperature Thermoplastic
Number of Rows
2
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Mount Type
Surface
Connector System
Wire-to-Board
Contact Material
Brass
Contact Plating
Gold
Minimum Operating Temperature
-40°C
Termination Type
Solder
Maximum Operating Temperature
125°C
Standards/Approvals
CSA LR19980, UL E29179
País de Origem
China
Detalhes do produto
The Molex Micro-Fit 3.0 Vertical Header is engineered for reliable interconnections in Compact electronic assemblies. This robust header features a 3.00mm pitch, accommodating dual rows with 18 circuits, and is equipped with solder tabs for secure connections. Designed for power and wire-to-board applications, it provides excellent durability and thermal efficiency, ensuring optimal performance in high-temperature environments. The vertical orientation and Compact size facilitate easy integration into various PCB designs, making it an Ideal choice for engineers seeking efficiency and reliability in their electronic applications.