Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Nº de Estoque RS: 447-6827Marca: MolexPart Number: 43650-0312
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Documentos Técnicos

Especificações

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

3

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Termination Type

Solder

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

250 V

País de Origem

Mexico

Detalhes do produto

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Informações de estoque temporariamente indisponíveis.

R$ 308,75

R$ 61,75 Each (In a Pack of 5) (Sem VAT)

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded
Selecione o tipo de embalagem

R$ 308,75

R$ 61,75 Each (In a Pack of 5) (Sem VAT)

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded

Informações de estoque temporariamente indisponíveis.

Selecione o tipo de embalagem

QuantidadePreço unitárioPer Pacote
5 - 95R$ 61,75R$ 308,75
100 - 370R$ 43,96R$ 219,80
375 - 1495R$ 42,79R$ 213,95
1500 - 2995R$ 41,77R$ 208,85
3000+R$ 40,69R$ 203,45

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Documentos Técnicos

Especificações

Brand

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

3

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Termination Type

Solder

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Voltage

250 V

País de Origem

Mexico

Detalhes do produto

Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series

Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more