Documentos Técnicos
Especificações
Brand
NXPProduct Type
Microcontroller
Series
LPC2000
Package Type
TFBGA
Mount Type
Surface
Pin Count
180
Device Core
ARM7TDMI-S
Data Bus Width
32bit
Interface Type
SPI
Program Memory Size
512kB
Maximum Clock Frequency
72MHz
DACs
1 x 10 Bit
RAM Size
98kB
Maximum Supply Voltage
3.6V
Maximum Power Dissipation Pd
1.5W
Number of Programmable I/Os
136
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Height
0.85mm
Length
12.2mm
Standards/Approvals
RoHS
Width
12.2mm
Minimum Supply Voltage
3V
Number of Timers
4
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
8 x 10 Bit
Program Memory Type
FLASH
Detalhes do produto
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P.O.A.
Embalagem de Produção (Bandeja)
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P.O.A.
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Embalagem de Produção (Bandeja)
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Ideate. Create. Collaborate
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Documentos Técnicos
Especificações
Brand
NXPProduct Type
Microcontroller
Series
LPC2000
Package Type
TFBGA
Mount Type
Surface
Pin Count
180
Device Core
ARM7TDMI-S
Data Bus Width
32bit
Interface Type
SPI
Program Memory Size
512kB
Maximum Clock Frequency
72MHz
DACs
1 x 10 Bit
RAM Size
98kB
Maximum Supply Voltage
3.6V
Maximum Power Dissipation Pd
1.5W
Number of Programmable I/Os
136
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Height
0.85mm
Length
12.2mm
Standards/Approvals
RoHS
Width
12.2mm
Minimum Supply Voltage
3V
Number of Timers
4
Instruction Set Architecture
RISC
Automotive Standard
No
ADCs
8 x 10 Bit
Program Memory Type
FLASH
Detalhes do produto
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
