Documentos Técnicos
Especificações
Brand
Renesas ElectronicsLogic Family
CMOS
Product Type
Buffer & Line Driver
Logic Function
Buffer & Line Driver
IC Type
Buffer & Line Driver
Input Type
TTL
Output Type
3 State
Mount Type
Surface
Package Type
SOIC-20
Minimum Supply Voltage
0.3V
Pin Count
20
Maximum High Level Output Current
-15mA
Maximum Supply Voltage
3.3V
Maximum Low Level Output Current
64mA
Maximum Propagation Delay Time @ CL
5.1ns
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Standards/Approvals
RoHS, JEDEC
Series
74FCT244T
Supply Current
4.5mA
Automotive Standard
No
País de Origem
Taiwan, Province Of China
Detalhes do produto
The Renesas Electronics IDT octal buffer/line driver is built using an advanced dual metal CMOS technology. It is designed to be employed as a memory and address driver, clock driver, and bus-oriented transmitter/ receiver which provides improved board density.
Informações de estoque temporariamente indisponíveis.
R$ 12.940,00
R$ 12,94 Each (On a Reel of 1000) (Sem VAT)
1000
R$ 12.940,00
R$ 12,94 Each (On a Reel of 1000) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
1000
Documentos Técnicos
Especificações
Brand
Renesas ElectronicsLogic Family
CMOS
Product Type
Buffer & Line Driver
Logic Function
Buffer & Line Driver
IC Type
Buffer & Line Driver
Input Type
TTL
Output Type
3 State
Mount Type
Surface
Package Type
SOIC-20
Minimum Supply Voltage
0.3V
Pin Count
20
Maximum High Level Output Current
-15mA
Maximum Supply Voltage
3.3V
Maximum Low Level Output Current
64mA
Maximum Propagation Delay Time @ CL
5.1ns
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Standards/Approvals
RoHS, JEDEC
Series
74FCT244T
Supply Current
4.5mA
Automotive Standard
No
País de Origem
Taiwan, Province Of China
Detalhes do produto
The Renesas Electronics IDT octal buffer/line driver is built using an advanced dual metal CMOS technology. It is designed to be employed as a memory and address driver, clock driver, and bus-oriented transmitter/ receiver which provides improved board density.
