Documentos Técnicos
Especificações
Brand
RS ProProduct Type
Grease
Product Form
Paste
Package Size
30 g
Viscosity
200±80 Pa·s (S606B), 150±50 Pa·s (S606C)
Standards/Approvals
RoHS, EU
Maximum Operating Temperature
180°C
Minimum Operating Temperature
-40°C
País de Origem
Taiwan, Province Of China
Detalhes do produto
This general purpose heat sink silicone grease from RS Pro can be used across a number of applications and within a wide operating temperature range.
The compound is a thermal conductive and has a shelf life of 18 months from the date of manufacture when stored unopened or below 25°C. The thermal paste or CPU grease works by acting as an interface between the two heat sources. The thermal grease fills in all those minuscule imperfections, ensuring the maximum heat transfer between the CPU and heat-sink before cooling.
Electronic components e.g. IC, CPU, MOS, LED, M/B, P/S, LCD-TV, Notebook PC, telecom device, wireless hub; DDRII module; DVD applications; hand-set applications.
Informações de estoque temporariamente indisponíveis.
R$ 463,60
R$ 463,60 Each (Sem VAT)
1
R$ 463,60
R$ 463,60 Each (Sem VAT)
Informações de estoque temporariamente indisponíveis.
1
| Quantidade | Preço unitário |
|---|---|
| 1 - 5 | R$ 463,60 |
| 6 - 14 | R$ 451,75 |
| 15+ | R$ 449,71 |
Documentos Técnicos
Especificações
Brand
RS ProProduct Type
Grease
Product Form
Paste
Package Size
30 g
Viscosity
200±80 Pa·s (S606B), 150±50 Pa·s (S606C)
Standards/Approvals
RoHS, EU
Maximum Operating Temperature
180°C
Minimum Operating Temperature
-40°C
País de Origem
Taiwan, Province Of China
Detalhes do produto
This general purpose heat sink silicone grease from RS Pro can be used across a number of applications and within a wide operating temperature range.
The compound is a thermal conductive and has a shelf life of 18 months from the date of manufacture when stored unopened or below 25°C. The thermal paste or CPU grease works by acting as an interface between the two heat sources. The thermal grease fills in all those minuscule imperfections, ensuring the maximum heat transfer between the CPU and heat-sink before cooling.
Electronic components e.g. IC, CPU, MOS, LED, M/B, P/S, LCD-TV, Notebook PC, telecom device, wireless hub; DDRII module; DVD applications; hand-set applications.
