Documentos Técnicos
Especificações
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
País de Origem
China
Detalhes do produto
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Informações de estoque temporariamente indisponíveis.
R$ 176,50
R$ 7,06 Each (In a Pack of 25) (Sem VAT)
Padrão
25
R$ 176,50
R$ 7,06 Each (In a Pack of 25) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
Padrão
25
| Quantidade | Preço unitário | Per Pacote |
|---|---|---|
| 25 - 75 | R$ 7,06 | R$ 176,50 |
| 100 - 225 | R$ 6,95 | R$ 173,75 |
| 250 - 475 | R$ 6,78 | R$ 169,50 |
| 500 - 975 | R$ 6,70 | R$ 167,50 |
| 1000+ | R$ 6,50 | R$ 162,50 |
Documentos Técnicos
Especificações
Brand
STMicroelectronicsProduct Type
Chip Balun
Balance Impedance
100Ω
Maximum Insertion Loss
1.2dB
Mount Type
Surface
Pin Count
6
Maximum Frequency
8GHz
Minimum Frequency
3GHz
Minimum Operating Temperature
-40°C
Package Type
Bumpless CSP
Maximum Operating Temperature
105°C
Standards/Approvals
No
Length
1.825mm
País de Origem
China
Detalhes do produto
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
