Documentos Técnicos
Especificações
Brand
STMicroelectronicsProduct Type
Sensor
Sensor Type
Accelerometer, Gyroscope
Number of Axis
3
Technology
Digital, Analogue
Mount Type
Surface
Interface Type
Serial-I2C, Serial-SPI
Maximum Frequency Response
400kHz
Minimum Frequency Response
0kHz
Minimum Supply Voltage
1.71V
Maximum Supply Voltage
3.6V
Package Type
LGA
Sensitivity
0.49mg/LSB
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Pin Count
14
Standards/Approvals
No
Width
3mm
Series
ISM330DLC
Height
0.83mm
Length
2.5mm
Supply Current
750μA
Automotive Standard
No
Detalhes do produto
The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
Informações de estoque temporariamente indisponíveis.
P.O.A.
Each (On a Reel of 5000) (Sem VAT)
5000
P.O.A.
Each (On a Reel of 5000) (Sem VAT)
Informações de estoque temporariamente indisponíveis.
5000
Documentos Técnicos
Especificações
Brand
STMicroelectronicsProduct Type
Sensor
Sensor Type
Accelerometer, Gyroscope
Number of Axis
3
Technology
Digital, Analogue
Mount Type
Surface
Interface Type
Serial-I2C, Serial-SPI
Maximum Frequency Response
400kHz
Minimum Frequency Response
0kHz
Minimum Supply Voltage
1.71V
Maximum Supply Voltage
3.6V
Package Type
LGA
Sensitivity
0.49mg/LSB
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
85°C
Pin Count
14
Standards/Approvals
No
Width
3mm
Series
ISM330DLC
Height
0.83mm
Length
2.5mm
Supply Current
750μA
Automotive Standard
No
Detalhes do produto
The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.STs family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.