Documentos Técnicos
Especificações
Brand
STMicroelectronicsProduct Type
Power Management Development Kit
Power Management Function
Power Management
For Use With
High Side Driver
Kit Classification
Evaluation Board
Featured Device
VNI8200XP
Kit Name
Demonstration Board
Standards/Approvals
RoHS
País de Origem
Italy
Detalhes do produto
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
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P.O.A.
1
P.O.A.
Informações de estoque temporariamente indisponíveis.
1
Documentos Técnicos
Especificações
Brand
STMicroelectronicsProduct Type
Power Management Development Kit
Power Management Function
Power Management
For Use With
High Side Driver
Kit Classification
Evaluation Board
Featured Device
VNI8200XP
Kit Name
Demonstration Board
Standards/Approvals
RoHS
País de Origem
Italy
Detalhes do produto
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
